Wafer Auto Loader, Astel

Quantity: In Stock

Category: Wafer Handling Equipment

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  • For 150mm, 200mm or 150mm/200mm wafer handling.
  • From thin to thick wafer in single system. Wafer thickness : 170 to 900um depending on warpage
  • Optional TAIKO wafer handling kits for wafer down to 60um
  • Observation method : Front macro, back macro and micro inspection
  • Computer control touch screen interface recipe management system
  • Sequential, sampling or statistical inspection mode.
  • Inspection of back macro is handling by non contact Bernoulli effect pad.
  • Cassette moves up and down by conventional indexer with laser mapping
  • Optical edge detection for centering and alignment
  • 525nm green illumination source provide very effective macro inspection

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Wafer Auto Loader, Astel

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Product Specifications

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