Wafer Auto Loader, Astel
- For 150mm, 200mm or 150mm/200mm wafer handling.
- From thin to thick wafer in single system. Wafer thickness : 170 to 900um depending on warpage
- Optional TAIKO wafer handling kits for wafer down to 60um
- Observation method : Front macro, back macro and micro inspection
- Computer control touch screen interface recipe management system
- Sequential, sampling or statistical inspection mode.
- Inspection of back macro is handling by non contact Bernoulli effect pad.
- Cassette moves up and down by conventional indexer with laser mapping
- Optical edge detection for centering and alignment
- 525nm green illumination source provide very effective macro inspection
Sorry, Currently No Video Uploaded.
Sorry, Currently No File Uploaded.
Wafer Auto Loader, Astel
Please Leave Your Product Enquiry Here. We will Get Back To You Soon.
Product Specifications
- Product SKU : -
- Weight (GRAM) : -
- Dimension : -
Related Products
